3D IC Integration and Packaging

3D IC Integration and Packaging

By: John H. Lau (author)Hardback

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A comprehensive guide to 3D IC integration and packaging methods and solutions, featuring detailed examples and real-world applications Semiconductor manufacturers are continuously seeking new paths to design and fabricate ICs with increased density, higher bandwidth, and lower power. Many design teams are now looking to 3D IC integration as an enabling technology for the development of the next generation of semiconductors. Based on a popular course developed by its author, 3D IC Integration and Packaging is written so that you can quickly acquire problem-solving skills and understand the trade-offs inherent in making system-level decisions. Provides cutting-edge, timely information on all aspects of 3D IC integration and packaging Advanced topics include TSV, thin-wafer handling, thermal management, and solder microbumping Practical applications of 3D IC technology are covered in full detail Author has written 16 engineering books and published more than 350 peer-reviewed papers

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About Author

John Lau, Ph.D., is both an ASME and an IEEE fellow. He has written 17engineering books, published more than 425 peer-reviewed papers, and given 290lectures, workshops, and keynotes worldwide.

Product Details

  • publication date: 01/09/2015
  • ISBN13: 9780071848060
  • Format: Hardback
  • Number Of Pages: 480
  • ID: 9780071848060
  • weight: 1013
  • ISBN10: 0071848061

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