Advanced Circuits for Emerging Technologies

Advanced Circuits for Emerging Technologies

By: Krzysztof Iniewski (author)Hardback

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Description

The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies. The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.

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About Author

Krzysztof (Kris) Iniewski, PhD, manages R&D developments at Redlen Technologies. He is also an executive director at CMOS Emerging Technologies. A former associate professor in the Electrical Engineering and Computer Engineering and Computer Engineering Department at the University of Alberta, Dr. Iniewski s Main research interest is in IC design for medical and networking applications.

Contents

Preface xiii Contributors xv PART I DIGITAL DESIGN AND POWER MANAGEMENT 1 DESIGN IN THE ENERGY DELAY SPACE 3 Massimo Alioto, Elio Consoli, and Gaetano Palumbo 1.1 Introduction 3 1.2 Energy and Delay Modeling 4 1.3 Energy Delay Space Analysis and Hardware-Intensity 14 1.4 Energy-Efficient Design of Digital Circuits 20 1.5 Design of Energy-Efficient Pipelined Systems 29 1.6 Conclusion 36 References 37 2 SUBTHRESHOLD SOURCE-COUPLED LOGIC 41 Armin Tajalli and Yusuf Leblebici 2.1 Introduction 41 2.2 Ultralow Power CMOS Logic: Design and Tradeoffs 43 2.3 Subthreshold Source-Coupled Logic 47 2.4 Power-Frequency Scaling 51 2.5 Conclusions 53 References 55 3 ULTRALOW-VOLTAGE DESIGN OF NANOMETER CMOS CIRCUITS FOR SMART ENERGY-AUTONOMOUS SYSTEMS 57 David Bol 3.1 Introduction 57 3.2 Impact of Technology Scaling on Subthreshold MOSFET Characteristics 61 3.3 Scaling Trend of the Minimum-Energy Point 63 3.4 Practical Energy of Nanometer ULV Circuits under Robustness and Timing Constraints 69 3.5 Technology/Circuit Methodology and Roadmap for ULV Design in the Nanometer Era 75 3.6 Conclusion 78 References 79 4 IMPAIRMENT-AWARE ANALOG CIRCUIT DESIGN BY RECONFIGURING FEEDBACK SYSTEMS 85 Ping-Ying Wang 4.1 Introduction 86 4.2 Theorem of Impairment-Aware Analog Design in Feedback Systems 86 4.3 Practical Implementations 89 4.4 Measured Results 96 4.5 Conclusions 99 References 100 5 ROM-BASED LOGIC DESIGN: A LOW-POWER DESIGN PERSPECTIVE 103 Bipul C. Paul 5.1 Introduction 103 5.2 RBL Design 105 5.3 RBL Adder 108 5.4 RBL Multiplier 111 5.5 Conclusions 116 References 117 6 POWER MANAGEMENT: ENABLING TECHNOLOGY 119 Lou Hutter and Felicia James 6.1 Macroeconomic Drivers for Power Technologies 119 6.2 Market Trends 122 6.3 Application Examples 123 6.4 Technology Implications and Trends 124 6.5 Current Technologies and Capabilities 130 6.6 Specific Application Example 140 6.7 Emerging Technologies 142 6.8 Conclusion 143 References 143 7 ULTRALOW POWER MANAGEMENT CIRCUIT FOR OPTIMAL ENERGY HARVESTING IN WIRELESS BODY AREA NETWORK 147 Yen Kheng Tan, Yuanjin Zheng, and Huey Chian Foong 7.1 Introduction 147 7.2 Wireless Body Area Network 148 7.3 Optimal Energy Harvesting System 159 7.4 Ultralow Power Management Integrated Circuit for Solar Energy Harvesting System 163 7.5 Conclusions 171 References 171 PART II ANALOG AND RF DESIGN 8 ANALOG CIRCUIT DESIGN FOR SOI 177 Andrew Marshall 8.1 SOI Devices 177 8.2 Partially Depleted SOI 178 8.3 FDSOI and FinFET 181 8.4 Device Considerations (FDSOI AND PDSOI) 181 8.5 Analog Circuit Building Blocks 184 8.6 Operational Amplifiers 189 8.7 Operational Transconductance Amplifier 193 8.8 Radio Frequency Low-Noise Amplifier 197 8.9 Mixers and Analog Multipliers 197 8.10 Analog to Digital and Digital to Analog Converters 201 8.11 Summary 204 References 204 9 FREQUENCY GENERATION AND CONTROL WITH SELF-REFERENCED CMOS OSCILLATORS 207 Michael S. McCorquodale, Nathaniel Gaskin, and Vidyabhusan Gupta 9.1 Introduction 207 9.2 Self-Referenced CMOS Oscillators 211 9.3 Packaging 225 9.4 Conclusion 234 References 235 10 SYNTHESIS OF STATIC AND DYNAMIC TRANSLINEAR CIRCUITS 239 Bradley A. Minch 10.1 Translinear Circuits: What Is In a Name? 239 10.2 The Scope of Translinear Circuits 242 10.3 Static and Dynamic Translinear Circuit Synthesis 242 10.4 Static Translinear Circuit Synthesis Examples 250 10.5 Dynamic Translinear Circuit Synthesis Examples 260 References 272 11 MICROWATT POWER CMOS ANALOG CIRCUIT DESIGNS: ULTRALOW POWER LSIs FOR POWER-AWARE APPLICATIONS 277 Ken Ueno and Tetsuya Hirose 11.1 Introduction 277 11.2 Subthreshold Characteristics in a MOSFET 279 11.3 Low-Power Voltage Reference Circuits 284 11.4 Low-Power Current Reference Circuits 293 11.5 Example of Power-Aware LSI Applications: CMOS Smart Sensor for Monitoring the Quality of Perishables 299 11.6 Conclusion and Discussion 308 References 310 12 HIGH-SPEED CURRENT-MODE DATA DRIVERS FOR AMOLED DISPLAYS 313 Yong-Joon Jeon and Gyu-Hyeong Cho 12.1 Introduction 313 12.2 Current-Mode Drivers in Representation of the Second-Generation Current Conveyor 316 12.3 Improved Transient Current Feed-Forward Output Buffer 317 12.4 Push-Pull Transient Current Feedforward Output Buffer 324 12.5 Conclusion 332 References 333 13 RF TRANSCEIVERS FOR WIRELESS APPLICATIONS 335 Alireza Zolfaghari, Hooman Darabi, and Henrik Jensen 13.1 Transmitter Architectures 335 13.2 Cartesian Transmitters 336 13.3 Constant-Envelope Transmitters Using Phase Modulated Loops 339 13.4 Polar Transmitters 340 13.5 Case Studies 346 References 350 PART III DEVICE LAYOUT AND RELIABILITY 14 TECHNOLOGY-AWARE COMMUNICATION ARCHITECTURE DESIGN FOR PARALLEL HARDWARE PLATFORMS 355 Davide Bertozzi, Alessandro Strano, Daniele Ludovici, and Francisco Gilabert 14.1 Introduction 355 14.2 NoC Building Blocks: The Switch 358 14.3 NoC Connectivity Pattern 362 14.4 NoCs and the GALS Paradigm 372 14.5 Putting Everything Together: Technology-Aware Network Connectivity 385 14.6 Looking Forward: Mesochronous Synchronization 389 14.7 Conclusions 390 References 390 15 DESIGN AND OPTIMIZATION OF INTEGRATED TRANSMISSION LINES ON SCALED CMOS TECHNOLOGIES 393 Federico Vecchi, Matteo Repossi, Wissam Eyssa, Paolo Arcioni, and Francesco Svelto 15.1 Introduction 393 15.2 Coplanar Waveguides 394 15.3 Shielded Transmission Lines 397 15.4 Accurate and Fast Analysis of Periodic Lines 402 15.5 Design and Experimental Results 406 15.6 Conclusions 411 References 413 16 ON-CHIP SURFING INTERCONNECT 415 Suwen Yang and Mark Greenstreet 16.1 Introduction 415 16.2 Surfing 417 16.3 Surfing DLLs 419 16.4 Pipelined Clock Forwarding 423 16.5 Source Synchronous Surfing 427 16.6 Surfing Handshakes 431 16.7 Summary 435 References 436 17 ON-CHIP SPIRAL INDUCTORS WITH INTEGRATED MAGNETIC MATERIALS 439 Wei Xu, Saurabh Sinha, Hao Wu, Tawab Dastagir, Yu Cao, and Hongbin Yu 17.1 Introduction 439 17.2 Previous Work 441 17.3 Magnetic Materials 443 17.4 Simulation Study 447 17.5 Device Fabrication 451 17.6 Measurement Results 453 17.7 Potential Applications of On-Chip Spiral Inductors with Magnetic Materials 455 17.8 Conclusion 458 References 458 18 RELIABILITY OF NANOELECTRONIC VLSI 463 Milos Stanisavljevic, Alexandre Schmid, and Yusuf Leblebici 18.1 Introduction 463 18.2 Increased Defect Density and Reliability 464 18.3 Reliability Evaluation 466 18.4 Historically Important CAD Tools 467 18.5 Recent Progress 469 18.6 Monte Carlo Reliability Evaluation Tool 473 18.7 Fault-Tolerant Computing 476 18.8 Conclusions 476 References 477 19 TEMPERATURE MONITORING ISSUES IN NANOMETER CMOS INTEGRATED CIRCUITS 483 Pablo Ituero and Marisa Lopez-Vallejo 19.1 Introduction 483 19.2 From Where Does Heat Come in Nanometer Circuits? 485 19.3 Harmful Effects Due to Temperature in VLSI Chips 488 19.4 Temperature Sensing for DTM 493 19.5 Thermal Modeling 498 19.6 Thermal Sensor Placement and Allocation 500 19.7 Temperature Monitoring Networks 503 19.8 Conclusions 505 References 505 PART IV CIRCUIT TESTING 20 LOW-POWER TESTING FOR LOW-POWER LSI CIRCUITS 511 Xiaoqing Wen and Yervant Zorian 20.1 Introduction 511 20.2 Test Power Problem in Logic LSI Testing 513 20.3 Basic Strategies to Test Power Reduction 515 20.4 Shift Power Reduction 517 20.5 Capture Power Reduction 519 20.6 Toward Next-Generation Low-Power Testing Solutions 522 20.7 Summary 525 References 526 21 CHECKERS FOR ONLINE SELF-TESTING OF ANALOG CIRCUITS 529 Haralampos-G. Stratigopoulos and Yiorgos Makris 21.1 Introduction 529 21.2 Time-Invariant Linear Circuits 531 21.3 Fully Differential Circuits 542 21.4 Conclusions 553 References 553 22 DESIGN AND TEST OF ROBUST CMOS RF AND MM-WAVE RADIOS 557 Sleiman Bou-Sleiman and Mohammed Ismail 22.1 Introduction 557 22.2 Why Robust RF and mm-Wave ICs? 558 22.3 Design Methodology for First-Time-Right Radio SoCs 564 22.4 Robust RF and mm-Wave Radio Transceivers 571 22.5 Summary 578 References 579 23 CONTACTLESS TESTING AND DIAGNOSIS TECHNIQUES 581 Selahattin Sayil 23.1 Introduction 581 23.2 Electron-Beam Method 582 23.3 Photoemissive Probing 583 23.4 Electro-Optic Probing 584 23.5 Charge Density Probing 587 23.6 Photoexcitation Probe Techniques 588 23.7 Electric Force Microscopy 589 23.8 Capacitive Coupling Method 590 23.9 Dynamic Internal Testing of CMOS using Hot-Carrier Luminescence 591 23.10All-Silicon Optical Contactless Testing of Integrated Circuits 592 23.11Conclusion 596 References 596 INDEX 599

Product Details

  • publication date: 12/06/2012
  • ISBN13: 9780470900055
  • Format: Hardback
  • Number Of Pages: 632
  • ID: 9780470900055
  • weight: 986
  • ISBN10: 0470900059

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  • 1st Class Delivery: Yes
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