Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today's package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types. It is suitable for MEMS and microelectronics engineers and researchers.
Marc P.Y. Desmulliez is the head of the research institute in sensors, signals, and systems at Heriot-Watt University. He earned his Ph.D. in electrical engineering from Heriot-Watt University. Suzanne Costello is a development scientist at MCS Ltd. She earned her Ph.D. in engineering from Heriot-Watt University.
Introduction to hermetic packages and leak types; Traditional hermeticity test techniques and standards; Limitations of existing hermeticity test methods in low volume packages; Novel methods of leak detection; Conclusions and vision.