Innovation in East Asia: The Challenge to Japan

Innovation in East Asia: The Challenge to Japan

By: Michael Hobday (author), Chris Freeman (foreword_author)Hardback

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"Innovation in East Asia" shows how "latecomer" firms from Taiwan, South Korea, Hong Kong and Singapore caught up technologically with Japan and learned to innovate. Michael Hobday examines the technology acquisition strategies of these firms, their strengths and weaknesses, and the origin and extent of latecomer innovation in the region. A series of detailed case studies are used not only to show how individual companies developed, but also how large groups of firms formed industrial clusters from behind the technology frontier. Taiwan, South Korea, Hong Kong and Singapore have emerged as dynamic and distinct forces for growth and innovation. Increasingly the competitive challenge for Japan comes from these countries rather than from Europe and America. The book extends conventional innovation theory to develop an analytical framework for understanding the strengths, weaknesses and future prospects of latecomer firms.

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Part 1 Introduction - East Asia's technological development: the challenge to Japan; objectives of the study; research methods; theoretical concerns; book structure; lessons for other countries. Part 2 East Asian regional dynamics: understanding the region's progress; economic growth; regional development; trade and technology; the importance of electronics; the flying geese model; overseas Chinese models; the role of the US economy; technological reliance on Japan; investments in the dragons; outward investment by the four NIEs; the role of the dragons in East Asia. Part 3 The latecomer firm: analytical framework; defining technology and learning; latecomers, leaders and followers; technology acquisition channels; the simple model; latecomer technological learning; linking technology to the market; latecomers and innovation theory; product life cycles and latecomer firms; innovation, imitation and learning; key research questions to explore. Part 4 The Republic of Korea - catching up in large corporations: compressing the cycle of technological learning; policies for industrial development; policies for education; stages of technological development; phases of development in electronics; strengths and weaknesses in electronics; institutions for learning foreign technology; the OEM and ODM system; size and scope of the "chaebol"; learning to innovate - Anam Industrial; Samsung - leadership in semiconductors; Samsung - following in consumer electronics; Samsung - fast learning in telecommunications; innovation management challenges; continuing latecomer orientation. Part 5 Taiwan - small firm innovation clusters: the comparison with South Korea; the historical context; achievements in electronics; phases of electronics development; strategic groups in Taiwan; foreign firms and joint ventures; the major manufacturing groups; from OEM to ODM to OBM; high technology start-ups; government-sponsored start-ups; a model of industrial clustering in Taiwan; behind the frontier innovation. Part 6 Singapore - a test case of leapfrogging: learning with TNCs; the leapfrogging argument; Singapore's economic development; policies for electronics; electronics and the economy; corporate technology strategies; semiconductors; the hard disk drive (HDD) industry; consumer electronics; a latecomer entrant in computers; Singapore's technological advance. Part 7 Hong Kong - "laissez-faire" technological development: market-led industrialization; the historical context; origin of the electronics industry; policies for electronics; performance in electronics; industry structure and advantages; expansion into China; strategies for innovation - Kong Wah; RJP - closing the technology gap; Motorola - TNC technological integration; Varitronix - a university spin off; Hong Kong's technological potential. Part 8 Conclusions and implications: interpreting the findings; limits to the electronics case. (Part contents).

Product Details

  • publication date: 18/08/1995
  • ISBN13: 9781858980171
  • Format: Hardback
  • Number Of Pages: 240
  • ID: 9781858980171
  • weight: 580
  • ISBN10: 1858980178

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