Introduction to Mechatronic Design

Introduction to Mechatronic Design

By: Thomas Kenny (author), J. Edward Carryer (author), R. Matthew Ohline (author)Hardback

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Description

Introduction to Mechatronic Design is ideal for upper level and graduate Mechatronics courses in Electrical, Computing, or Mechanical & Aerospace Engineering. ' Unlike other texts on mechatronics that focus on derivations and calculations, Introduction to Mechatronics, 1e, takes a narrative approach, emphasizing the importance of building intuition and understanding before diving into the math. The authors believe that integration is the core of mechatronics--and students must have a command of each of the domains to create the balance necessary for successful mechatronic design--and devote sections of the book to each area, including mechanical, electrical, and software disciplines, as well as a section on system design and engineering. A robust package of teaching and learning resources accompanies the book.

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About Author

Ed Carryer is the Director of the Smart Product Design Laboratory (SPDL) in the Design Division of Mechanical Engineering at Stanford University. He is currently a Consulting Professor in the Design Division of Mechanical Engineering. He received his Ph.D. degree in Mechanical Engineering from Stanford University in 1992. Prior to that, he received an M.S. in Bio-Medical Engineering from the University of Wisconsin, Madison in 1978. His B.S.E. was awarded from the Illinois Institute of Technology in 1975, where he was a member (1/3) of the first graduating class of the Education and Experience in Engineering (E 3)program.

Dr. Carryer's industrial experience varies wildly, from designing water treatment facilities for coal and nuclear power plants for Sargent & Lundy to designing the electronic controller for an Arctic Heated Glove under contract to NASA. He spent eight years in the Detroit area working in and about the auto industry. During that time he worked for Ford, GM and AMC on electronic engine control systems, predominantly for turbo-charged engines. He has an active design consultancy that has tackled such varied projects as an engine controller for an outboard motor manufacturer, an automated blood gas analyzer, and a turbo-charger boost control system for a new type of turbo-charger.

Matt Ohline is an Associate Consulting Professor in the Design Division of Mechanical Engineering at Stanford University.

Thomas Kenny is a Professor in the Mechanical Engineering department at Stanford University. Dr. Kenny received his PhD in Physics from UC Berkeley.

Dr. Kenny's research group is researching fundamental issues and applications of micromechanical structures. These devices are usually fabricated from silicon wafers using integrated circuit fabrication tools. Using these techniques, the group builds sensitive accelerometers, infrared detectors, and force-sensing cantilevers. This research has many applications, including integrated packaging, inertial navigation, fundamental force measurements, experiments on bio-molecules, device cooling, bio-analytical instruments, and small robots. Because this research field is multidisciplinary in nature, work in this group is characterized by strong collaborations with other departments, as well as with local industry.

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Contents

Part 1: Introduction Preface Chapter 1 Introduction 1.1 Philosophy 1.3 Who Should Study Mechatronics? 1.3 How to Use this Book 1.4 Summary Part 2: Software Chapter 2 What's a Micro? 2.1 Introduction 2.2 What IS a "Micro"? 2.3 Microprocessors, Microcontrollers, Digital Signal Processors (DSP's) and More 2.4 Microcontroller Architecture 2.5 The Central Processing Unit (CPU) 2.5.1 Representing Numbers in the Digital Domain 2.5.2 The Arithmetic Logic Unit (ALU) 2.6 The Data Bus and the Address Bus 2.7 Memory 2.8 Subsystems and Peripherals 2.9 Von Neumann Architecture 2.10 The Harvard Architecture 2.11 Real World Examples 2.11.1 The Freescale MC9S12C32 Microcontroller 2.11.2 The Microchip PIC12F609 Microcontroller 2.12 Where to Find More Information 2.13 Homework Problems Chapter 3 Microcontroller Math and Number Manipulation 3.1 Introduction 3.2 Number Bases and Counting 3.3 Representing Negative Numbers 3.4 Data Types 3.5 Sizes of Common Data Types 3.6 Arithmetic on Fixed Size Variables 3.7 Modulo Arithmetic 3.8 Math Shortcuts 3.8 Boolean Algebra 3.9 Manipulating Individual Bits 3.10 Testing Individual Bits 3.11 Homework Problems Chapter 4: Programming Languages 4.1 Introduction 4.2 Machine Language 4.3 Assembly Language 4.4 High-Level Languages 4.5 Interpreters 4.6 Compilers 4.7 Hybrid Compiler/Interpreters 4.8 Integrated Development Environments (IDEs) 4.9 Choosing a Programming Language 4.10 Homework Problems Chapter 5: Program Structures for Embedded Systems 5.1 Background 5.2 Event Driven Programming 5.3 Event Checkers 5.4 Services 5.5 Building an Event Driven Program 5.6 An Example 5.7 Summary of Event Driven Programming 5.8 State Machines 5.9 A State Machine in Software 5.10 The Cockroach Example as a State Machine 5.11 Summary Homework Problems Chapter 6 Software Design 6.1 Introduction 6.2 Building as a Metaphor for Creating Software 6.3 Introducing Some Software Design Techniques 6.3.1 Decomposition 6.3.2 Abstraction and Information Hiding 6.3.3 Pseudo-Code 6.4 Software Design Process 6.4.1 Generating Requirements 6.4.2 Defining the Program Architecture 6.4.3 The Performance Specification 6.4.4 The Interface Specification 6.4.5 Detail Design 6.4.6 Implementation 6.4.6.1 Intra-Module Organization 6.4.6.2 Writing the Code 6.4.7 Unit Testing 6.4.8 Integration 6.5 The Sample Problem 6.5.1 Requirements for the Morse Code Receiver 6.5.2 The Morse Code Receiver System Architecture 6.5.3 The Morse Code Receiver Software Architecture 6.5.4 The Morse Code Receiver Performance Specifications 6.5.5 The Morse Code Receiver Interface Specification 6.5.5.1 The Button Module Interface Specification 6.5.5.2 The Morse Elements Module Interface Specification 6.5.5.3 The Morse Decode Module Interface Specification 6.5.5.4 The LCD Display Module Interface Specification 6.5.6 The Morse Code Receiver Detail Design 6.5.6.1 Button Module Detail Design 6.5.6.2 Morse Elements Detail Design 6.5.6.3 Morse Decode Detail Design 6.5.6.4 Display Detail Design 6.5.6.5 Main Detail Design 6.5.7 The Morse Code Receiver Implementation 6.5.8 The Morse Code Receiver Unit Testing. 6-28 6.5.9 The Morse Code Receiver Integration 6.6 Homework Problems Chapter 7 Communications 7.1: Introduction 7.2: Without a Medium, there is no Message 7.3: Bit-Parallel and Bit-Serial Communications 7.3.1: Bit-Serial Communications 7.3.1.1: Synchronous Serial Communications 7.3.1.2: Asynchronous Serial Communications 7.3.2: Bit Parallel Communications 7.4: Signaling Levels 7.4.1: TTL/CMOS Levels 7.4.2: RS-232 7.4.3: RS-485 7.5: Communicating Over Limited Bandwidth Channels 7.5.1: Telephones and Modems 7.5.1.1: Modulation Techniques 7.5.1.2: Amplitude Modulation (AM) 7.5.1.3: Frequency Modulation (FM) 7.5.1.4: Phase Modulation (PM) 7.5.1.5: Quadrature Amplitude Modulation (QAM) 7.6: Communicating with Light 7.7: Communicating over a Radio 7.7.1: RF Remote Controls 7.7.2: RF Data Links 7.7.3: RF Networks 7.8: Homework Problems Chapter 8 : Microcontroller Peripherals 8.1 : Accessing the Control Registers 8.2 : The Parallel Input/Output Subsystem 8.2.1 : The Data Direction Register 8.2.2 : The Input/Output Register(s) 8.2.3 : Shared Function Pins 8.3 : Timer Subsystems 8.3.1 : Timer Basics 8.3.2 : Timer Overflow 8.3.3 : Output Compare 8.3.4 : Input Capture 8.3.5 : Combining Input Capture and Output Compare to Control an Engine 8.4 : Pulse Width Modulation (PWM) 8.5 : PWM Using the Output Compare System 8.6 : The Analog-to-Digital (A/D) Converter Subsystem 8.6.1 : The Process for Converting an Analog Input to a Digital Value 8.6.2 : The A/D Converter Clock 8.6.3 : Multiplexer Switching Transients and DC Effects 8.6.4 : Automating the A/D Conversion Process 8.7 : Homework Problems Part 3: Electronics Chapter 9 Basic Circuit Analysis and Passive Components 9.1 Voltage, Current and Power 9.2 Circuits and Ground 9.3 Laying Down the Laws 9.4 Resistance 9.4.1 Resistors in Series and Parallel 9.4.2 The Voltage Divider 9.5 Thevenin Equivalents 9.6 Capacitors 9.6.1 Capacitors in Series and Parallel 9.6.2 Capacitors and Time-Varying Signals 9.7 Inductors 9.7.1 Inductors and Time-Varying Signals 9.8 The Time and Frequency Domains 9.9 Circuit Analysis with Multiple Component Types 9.9.1 Basic RC Circuit Configurations 9.9.2 Low-Pass RC Filter Behavior in the Time Domain 9.9.3 High-Pass RC Filter Behavior in the Time Domain 9.9.4 RL Circuit Behavior in the Time Domain 9.9.5 Low-Pass RC Filter Behavior in the Frequency Domain 9.9.6 High-Pass RC Filter Behavior in the Frequency Domain 9.9.7 High-Pass RC Filter with a DC Bias 9.10 Simulation Tools 9.10.1 Limitations of Simulation Tools 9.11 Real Voltage Sources 9.12 Real Measurements 9.12.1 Measuring Voltage 9.12.2 Measuring Current 9.13 Real Resistors 9.13.1 A Model for a Real Resistor 9.13.2 Resistor Construction Basics 9.13.3 Carbon Film Resistors 9.13.4 Metal Film Resistors 9.13.5 Power Dissipation in Resistors 9.13.6 Potentiometers 9.13.7 Multi-Resistor Packages 9.13.8 Choosing Resistors 9.14 Real Capacitors 9.14.1 A Model for a Real Capacitor 9.14.2 Capacitor Construction Basics 9.14.3 Polar vs. Non-Polar Capacitors 9.14.4 Ceramic Disk Capacitors 9.14.5 Monolithic Ceramic Capacitors 9.14.6 Aluminum Electrolytic Capacitors 9.14.7 Tantalum Capacitors 9.14.8 Film Capacitors 9.14.9 Electric Double Layer Capacitors / Super capacitors 9.14.10 Capacitor Labeling 9.14.10.1 Ceramic Capacitor (Disc and MLC) Labeling 9.14.10.2 Aluminum Electrolytic Capacitor Labeling 9.14.10.3 Tantalum Capacitor Labeling 9.14.10.4 Film Capacitor Labeling 9.14.11 Choosing a Capacitor 9.15 Homework Problems Chapter 10 Semiconductors 10.1 Doping, Holes and Electrons 10.2 Diodes 10.2.1 The VI Characteristic for Diodes 10.2.2 The Magnitude of Vf 10.2.3 Reverse Recovery 10.2.4 Schottky Diodes 10.2.5 Zener Diodes 10.2.6 Light Emitting Diodes 10.2.7 Photo-Diodes 10.3 Bipolar Junction Transistors 10.3.1 The Darlington Pair 10.3.2 The Photo-Transistor 10.4 MOSFETs 10.5 hoosing Between BJTs and MOSFETs 10.5.1 When Will a BJT be the Best (or Only) Choice? 10.5.2 When Will a MOSFET be the Best (or Only) Choice? 10.5.3 How Do You Choose When Either a MOSFET or a BJT Could Work? 10.6 Multi-Transistor Circuits 10.7 Reading Transistor Data Sheets 10.7.1 Reading a BJT Data Sheet 10.7.2 Reading a MOSFET Data Sheet 10.7.3 A Sample Application 10.7.4 A Potpourri of Transistor Circuits 10.8 Homework Problems Chapter 11 : Operational Amplifiers 11.1 : Operational Amplifier Behavior 11.2 : Negative Feedback 11.3 : The Ideal Op-Amp 11.4 : Analyzing Op-Amp Circuits 11.4.1 : The Golden Rules 11.4.2 : The Non-Inverting Op-Amp Configuration 11.4.3 : The Inverting Op-Amp Configuration 11.4.3.1 : The Virtual Ground 11.4.3.2 : There is Nothing Magic About Ground 11.4.4 : The Unity Gain Buffer 11.4.5 : The Difference Amplifier Configuration 11.4.6 : The Summer Configuration 11.4.7 : The Trans-Resistive Configuration 11.4.8 : Computation with Op-Amps 11.5 : The Comparator 11.5.1 : Comparator Circuits 11.6 : Homework Problems Chapter 12 : Real Operational Amplifiers and Comparators 12.1 : Real Op-Amp Characteristics - How the Ideal Assumptions Fail 12.1.1 : Non-Infinite Gain 12.1.2 : Variation in Open Loop Gain with Frequency 12.1.3 : Input Current is Not Zero 12.1.3.1 : Input Bias Current and Input Offset Current 12.1.3.2 : Input Impedance 12.1.4 : The Output Voltage Source is Not Ideal 12.1.5 : Other Non-Idealities 12.1.5.1 : Input Offset Voltage 12.1.5.2 : Power Supplies 12.1.5.3 : Input Common Mode Voltage Range 12.1.5.5 : Input Common Mode Rejection Ratio 12.1.5.6 : Temperature Effects 12.2 : Reading an Op-Amp Data Sheet 12.2.1 : Maxima, Minima and Typical Values 12.2.2 : The Front Page 12.2.3 : The Absolute Maximum Ratings Section 12.2.4 : The Electrical Characteristics Section 12.2.5 : The Packaging Section 12.2.6 : The Typical Applications Section 12.3 : Reading a Comparator Data Sheet 12.3.1 : Comparator Packaging 12.4 : Comparing Op-Amps 12.5 : Homework Problems Chapter 13 Sensors 13.1 Introduction 13.2 Sensor Output & Microcontroller Inputs 13.3 Sensor Design 13.3.1 Measuring Temperature with a Thermistor 13.3.2 Measuring Acceleration 13.3.3 Definitions of Sensor Performance Characteristics 13.4 Fundamental Sensors and Interface Circuits 13.4.1 Switches as Sensors 13.4.2 Interfacing to Switches 13.4.3 Resistive Sensors 13.4.4 Interfacing to Resistive Sensors 13.4.4.1 Using a Resistive Sensor in a Voltage Divider 13.4.4.2 Measuring Resistance Using a Current Source 13.4.4.3 The Constant Current Circuit 13.4.4.4 The Wheatstone Bridge 13.4.5 Capacitive Sensors 13.4.6 Interfacing to Capacitive Sensors 13.4.6.1 Measuring Capacitance with a Step Input 13.4.6.2 Measuring Capacitance with an Oscillator 13.4.6.3 Measuring Capacitance with a Wheatstone Bridge 13.5 A Survey of Sensors 13.5.1 Light Sensors 13.5.1.1 Photodiodes 13.5.1.2 Phototransistors 13.5.1.3 Emitter-Detector Pair Modules 13.5.1.4 Photocells 13.5.2 Strain Sensors 13.5.2.1 Metal Foil Strain Gages 13.5.2.2 Piezoresistive Strain Gages 13.5.2.3 Load Cells 13.5.3 Temperature Sensors 13.5.3.1 Thermocouples 13.5.3.2 Thermistors 13.5.4 Magnetic Field Sensors 13.5.4.1 Hall Effect Sensors 13.5.4.3 Reed Switches 13.5.5 Proximity Sensors 13.5.5.1 Capacitive Proximity Sensors 13.5.5.2 Inductive Proximity Sensors 13.5.5.3 Ultrasonic Proximity Sensors 13.5.6 Position Sensors 13.5.6.1 Potentiometers 13.5.6.2 Optical Encoders 13.5.6.3 Inductive Pickups / Gear Tooth Sensors 13.5.6.4 Reflective Infrared Sensors 13.5.6.5 Capacitive Displacement Sensors 13.5.6.6 Ultrasonic Displacement Sensors 13.5.6.7 Flex Sensors 13.5.7 Acceleration Sensors

Product Details

  • publication date: 17/12/2010
  • ISBN13: 9780131433564
  • Format: Hardback
  • Number Of Pages: 816
  • ID: 9780131433564
  • weight: 1778
  • ISBN10: 0131433563

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