ISTFA 2008: International Symposium for Testing and Failure Analysis (Book & CD)

ISTFA 2008: International Symposium for Testing and Failure Analysis (Book & CD)

By: ASM International (editor)Paperback

Up to 2 WeeksUsually despatched within 2 weeks


This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results. Table of Contents Includes papers relating to the analysis of integrated circuits, MEMS, nanodevices, optoelectronics, discrete and passive components, electronic packaging, card level components, and electronic systems in the following areas:New and emerging analytical techniques, sensors, and instrumentationDiagnostic testing and debug* Physical fault isolation (optical, thermal, magnetic, etc.)Electrical characterization and nanoprobingScanning probe technologyMicroscopy (SEM, TEM, light microscopy, etc.)Physical circuit-edit techniques (FIB, laser, etc.)Sample preparation (milling, polishing, etching, grinding, etc.)Chemical and materials analysis (Auger, SIMS, RBS, etc.)Metrology and in-line characterization and analysisYield and reliability enhancementCompetitive analysisImage processingAnalytical thought-processLaboratory and environmental safety and green processesAutomationLaboratory management and financeFuture challenges, such as those relating to the deep nanoscale regime

Product Details

  • ISBN13: 9780871707147
  • Format: Paperback
  • Number Of Pages: 500
  • ID: 9780871707147
  • ISBN10: 0871707144

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