Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.
Si-on-Si multichip module technology and its applications, K.L. Tai; early assessment of design, packaging and technology tradeoffs, D. Lapotin; design automation for MCM - issues and status, P. Chan; the VAX 9000 multichip packaging and its evolution to future high end computer applications, C.W. Ho; performance driven layout for thin-film multichip modules, W-M. Dai; transient simulation of lossy coupled transmission lines characterized with frequency-dependent parameters, O. Wing and F-Y. Chang.