Microassembly of MEMS based on micrometric components is one of the most promising approaches to achieve high-performance MEMS. Two approaches are currently developed for microassembly: self-assembly and robotic microassembly. This text presents a complete overview of robotic microassembly, from microworld modeling and handling strategies, to the design of microassembly robotic devices and microassembly methods. The coverage features micromanipulation and microrobotic assembly, including automation, with many examples. This resource presents an objective view of robotic assembly by eight authors based in eight different research institutes involved in micro-assembly worldwide.
MICHAEL GAUTHIER, PhD, is a researcher at the Centre National de la Recherche Scientifique (CNRS), working with the Automation and Micromechatronic Systems Department in the FEMTO-ST Institute in France. His research interests focus on the modeling and study of automatic micromanipulation strategies, with an emphasis on artificial microobjects under 50 m. STEPHANE REGNIER, PhD, is Professor as well as head of the micromanipulation team at the Institut des Systemes Intelligents et Robotique (ISIR) in France. His research examines microscale phenomena such as micromechatronics and biological cell micromanipulation.
Preface. Introduction. PART I MODELING OF THE MICROWORLD. 1 Microworld modeling in Vacuum and Gaseous Environments. 1.1 Introduction. 1.2 Classical models. 1.3 Recent developments. References. 2 Microworld Modelling: Impact of liquid and roughness. 2.1 Introduction. 2.2 Liquid environments. 2.3 Microscopic analysis. 2.4 Surface Roughness. References. PART II HANDLING STRATEGIES. 3 Unified view of robotic microhandling and selfassembly. 3.1 Background. 3.2 Robotic Microhandling. 3.3 SelfAssembly. 3.4 Components of Microhandling. 3.5 Hybrid Microhandling. 3.6 Conclusion. References. 4 Towards a precise micro manipulation. 4.1 Introduction. 4.2 Handling principles and strategies adapted to the microworld. 4.3 Micromanipulation setup. 4.4 Experimentations. 4.5 Conclusion. References. 5 Microhandling Strategies and Microassembly in Submerged. Medium. 5.1 Introduction. 5.2 Dielectrophoretic Gripper. 5.3 Submerged freeze gripper. 5.4 Chemical control of the release in submerged handling. 5.5 Release on adhesive substrate and microassembly. 5.6 Conclusion. References. PART III ROBOTIC AND MICROASSEMBLY. 6 Robotic microassembly of 3D MEMS Structures. 6.1 Introduction. 6.2 Methodology of the Microassembly System. 6.3 Robotic Micromanipulator. 6.4 Overview of Microassembly System. 6.5 Modular Design Features for Compatibility with the Microassembly System. 6.6 Grasping Interface (Interface Feature). 6.7 PMKIL Microassembly Process. 6.8 Experimental Results and discussion. 6.9 Conclusion. References. 7 High Yield Automated MEMS Assembly. 7.1 Introduction. 7.2 General Guidelines for 2 1 2D Microassembly. 7.3 Compliant Part Design. 7.4 3 Microassembly System. 7.5 High Yield Microassembly. 7.6 Conclusion and Future work. References. 8 Design of a desktop microassembly machine and its industrial. application to micro solder ball manipulation. 8.1 Introduction. 8.2 Outline of the machine design to achieve fine accuracy. 8.3 Application to the joining process of electric Components. 8.4 Pursuing higher accuracy. 8.5 Conclusion. References.