This forward-looking resource presents the latest details on smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications. Engineers find comprehensive details on LCP (liquid crystal polymers), metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives.
Guoan Wang is an advisory engineer/scientist at the IBM Semiconductor Research and Development Center in Essex Junction, Vermont. He holds an M.S. in materials science and engineering from Zhejiang University, an M.S. in electrical engineering from Arizona State University, and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology. Bo Pan is a senior RF engineer at Realtek Semiconductor Corporation in Irvine, California. He holds an M.S. in electrical engineering from Tsinghua University and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology.
Introduction; Overview of RF Passives; Liquid Crystal Polymer Based Flexible Passives; Ferrite Materials for RF Passives; RF Passives with High Aspect Ratio Enabled Material; CNT-Based Tunable or Detectable Passives; Paper-Based Green RFID; Flexible Magnetic Composites; Metamaterial-Based RF RF Passives; Micromachining Technique and On-Chip Passive Design.