In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.
Michael P. Gaynor is RF technical director of the SiP Group at CEL in Wauconda, Illinois, where he is involved in all phases of projects enabling low-cost, small-size, high performance modules through architecture and circuit modification. Previously he was a senior staff RF development engineer with Motorola. He has 18 years of RF design experience and four years of RF SiP design experience. He holds several patents and has published several articles and papers on topics in the field.
Introduction. LTCC versus Laminate. Assembly Process. TX and RX Architecture. RF Components. Filters. Other Passive Circuits. Active Circuit Design. Oscillators and Synthesizers. Advanced Packaging Techniques (Designs). Advanced RF Design Techniques.