Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
By
Er-Ping Li (Author)
Hardback
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Also available on eBook for £98.99. Click here to purchase from Rakuten Kobo
About the Author
ER-PING LI, PhD, holds an appointment as Chair Professor at Zhejiang University, China, and has also been a principal scientist and director at the Institute of High Performance Computing, Singapore. He is a Fellow of the IEEE and a Fellow of the Electromagnetics Academy. He has received numerous awards and honors in recognition of his professional work from the IEEE and other professional bodies. Dr. Li is a pioneer in the modeling and simulation for signal/power and EMC in integrated circuits and electronic systems packaging. He has chaired or spoken at numerous international conferences and universities, and has also served as editor to several IEEE Transactions.
More Details
- Contributor: Er-Ping Li
- Imprint: Wiley-IEEE Press
- ISBN13: 9780470623466
- Number of Pages: 384
- Packaged Dimensions: 163x244x31mm
- Packaged Weight: 785
- Format: Hardback
- Publisher: John Wiley & Sons Inc
- Release Date: 2012-04-19
- Binding: Hardback
- Biography: ER-PING LI, PhD, holds an appointment as Chair Professor at Zhejiang University, China, and has also been a principal scientist and director at the Institute of High Performance Computing, Singapore. He is a Fellow of the IEEE and a Fellow of the Electromagnetics Academy. He has received numerous awards and honors in recognition of his professional work from the IEEE and other professional bodies. Dr. Li is a pioneer in the modeling and simulation for signal/power and EMC in integrated circuits and electronic systems packaging. He has chaired or spoken at numerous international conferences and universities, and has also served as editor to several IEEE Transactions.
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